Coating and Developing Equipment ACS300 Gen2
Type up to 300mm - Spin Coating/Developing Cluster
Wafer-level packaging for mass production and 3D integration.
- Company:ズース・マイクロテック
- Price:Other
1~2 item / All 2 items
Type up to 300mm - Spin Coating/Developing Cluster
Wafer-level packaging for mass production and 3D integration.
Fully automatic, compatible with a maximum of 200mm.
By docking our mask aligner module with the full-area exposure method, it can be used as the Ring Graphy Cluster LithoFab200.